Huawei Blade Mini Server CH222 V3 Compute Node Based On Intel Latest Grantley Processor

Quick DetailsProducts Status:StockType:BladeMax Memory Capacity:≥ 64GBMax Processors:2Processor Main Frequency:2.3GHzProcessor Type:Intel XeonBrand Name:HuaweiModel Number:CH222 V3Place of Origin:Shanghai, China (Mainland)Dimensions (H x W x D):60.46 mm *423 mm* 537.2 mmForm Factor:Full-width, 2-socket compute nodeNumber of Hard Disks:15 x 2.5-inch SAS/SATA HDDs or SSDsOperating Temperature:5 C to 40 CRAID Support:RAID 0, 1, 10, 5, 50, 6, and 60 with a 1 GB/2 GB RAID cachePCIe Expansion:2 PCIe x16 Mezz modulesFull configuration with 15 hard disks:15.3 kg (33.74 lb)Maximum power consumption:629WRated input voltage:12 V DCOperating humidity:5% RH to 85% RH (noncondensing)Packaging & DeliveryPackaging Details:original huawei carton packageDelivery Detail:within 7 days after the receipt of paymentStorage Blade server Huawei CH222 V3 compute node based on Intel latest Grantley processorProduct DescriptionThe CH222 V3 storage expansion compute node (CH222 V3 for short) is a full-width compute node based on Intel® latest Grantley processor platform and features superior computing performance and scalability by supporting a maximum of fifteen 2.5-inch disks. The CH222 V3 supports remote power-on and power-off control for a single disk and disk hot swapping.The CH222 V3 is installed in a E9000 chassis and managed by the MM910 management module in a centralized manner.The CH222 V3 is suitable for big-data analysis and processing applications that require large storage capacity and high computing performance, such as videos, searches, and biological sciences.1. Customization label2. Ejector lever on a compute node3. Spring on a compute node4. Indicator of hard disk drawer status5. Hard disk status indicator of dual colors6. High-density port7. Power button/indicator8. UID button/indicator9. HLY indicator10. Handle on the hard disk drawer11. Spring on the hard disk drawer SpecificationItemSpecificationsPhysical SpecificationsDimensions (H x W x D)60.46 mm × 423 mm × 537.2 mm (2.4 in. x 16.65 in. x 21.14 in.)ColorFront panel: blackCover: silver whiteWeightFull configuration with 15 hard disks: 15.3 kg(33.74 lb)Each disk: 300 g (0.66 lb)Packing materials: 3.6 kg (7.94 lb)Environmental SpecificationsTemperatureOperating temperature: 5°C to 40°C (41°F to 104°F)Storage temperature: -40°C to +65°C (-40°F to +149°F)Temperature change rate15°C/h (27°F/h)HumidityOperating humidity: 5% RH to 85% RH (noncondensing)Storage humidity: 5% RH to 95% RH (noncondensing)Altitude900 m (2952.72 ft) at 40°C (104°F)When the device is used in an altitude of 900 m to3000 m, the operating temperature decreases by 1°C(1.8°F) as the altitude increases by 300 m (984.24 ft).Technical SpecificationsForm FactorFull-width 2-socket compute nodeNumber of processors1 or 2Processor ModelIntel® Xeon® E5-2600 v3 seriesNumber of DIMMs24 DDR4 DIMMs, providing a maximum memory capacity of 1.5 TBNumber of Hard Disks15 x 2.5-inch SAS/SATA HDDs or SSDsRAID SupportRAID 0, 1, 10, 5, 50, 6, and 60 with a 1 GB/2 GB RAID cachePCIe Expansion2 PCIe x16 Mezz modules1 standard PCIe x 8 full-height, half-length cardOS SupportMicrosoft Windows Server 2008/2012Red Hat Enterprise LinuxSUSE Linux Enterprise ServerCitrix XenServerVMwarePower Rated input voltage12 V DCMaximum power consumption629 WFeaturesHuge storage and computing capabilities● Supports the full series of Intel ®Xeon®E5-2600 and E5-2600 v2 processors to deliver up to 2*twelve-core 2.7 GHz of computing power. ● Provides 24 DIMMs at 1.5 times the usual height. These apply mainstream granules and double the memory capacity to up to 768 GB DDR3 (providing the highest cost-efficiency for large-memory applications). ● Supports 15 x 2.5" SAS/SATA HDDs or SSDs, which provide the highest storage capacity on a single node.Minimum energy for maximum efficiency ● Adopts the dynamic energy saving and power capping technologies to optimally manage and control power consumption with power remarkably reduced in lowload operating. ● Applies carrier-class design, manufacturing processes, and components to ensure high quality.Intelligent platform for strong management● Reduces O&M costs by supporting remote deployment and fault location technologies such as SOL, KVM over IP, virtual DVD-ROM drive, WebUI and IPMI 2.0-compliant.● Provides efficient and secure power consumption analysis and control capabilities. Complies with Intel ®NM 2.0;Provides a sub-3s power capping response on each compute node to optimize ;power consumption control;Supports an intelligent and secure power-off mode for compute nodes. ● Supports the black box function to facilitate quick fault location and service recovery.Packaging & ShippingThe ability of supply: 200 Piece/Pieces per WeekTrade terms:FOB,CIF,CFR,etcSample availability:yes(not free)Pakage information:carton pakage with huawei original packageLead time: Within 5 working days after receipt payment.Shipment: Express, Air, SeaOur ServicesAfter-Sales Service ● We can provide detail documents and remote help for device installation and configuration. ● Warranty: 1 year. ( After the quality guarantee period began to charge appropriate maintenance service fee.) ● Our company promises goods enjoy full return due to quality problem since goods delivered within 7 days or 15 days , returned goods must keep original state and it's accessories are complete.